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Job Title: Microelectronics Operator
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Posted by: Lockheed Martin Corporation on Jun 20, 2010
Description:1.) Works under direction and from production schedules, manufacturing procedures, process plans and written or oral instruction.2.) Perform a variety of routine tests on production runs of microelectronics parts using test fixtures, and sorts product using various instruments. Test equipment utilized is manual, semi-automatic and automatic or probe-set bench set up. 3.) Operates and adjusts semi conductor die bond machine to bond die into packages per micro-circuit layout drawing. Requires careful handling for proper placement and alignment of dies. Requires the use of microscope and micro manipulators for precise control of die placement. 4.) Test silicon wafers using semi-automatic wafer probe apparatus, aligns wafers in apparatus, monitors equipment operation. 5.) Loads and unloads components into burn in sockets and further loads those sockets into burn in ovens. Loads and unloads test units in test computers, test fixtures and automatic handlers 6.) Operates and adjusts wire bond apparatus to bond fine wires from components to pads of substrate, from substrate to package leads, or from die directly to package leads. Involves working to microcircuit layout drawings; incumbent is responsible for proper wire dress, bond appearance and bond strength; and apparatus used includes microscope and micro-manipulators for precise movement and control. 7.) Sets up and operates manual, semi-automatic and automatic equipment such as package sealers, screen printers, wire bonders, laser trimmers and other similar microelectronics fabrication. Loads, monitors operation and unloads components from ovens, cleaning stations and marking machines. 8.) Checks product being fabricated/assembled for conformance to specifications and standard. Uses microscopes, leak detectors and other similar equipment which may require adjustment and involve a series of numerical and dial readouts and some interpretation. 9.) Performs specified rework involving removal and replacement of components, removal and repair of wires and/or wire boards. 10.) Flexibility to be trained in multiple Microelectronics processes including those that require use of chemicals. 11.) Visual acuity required to 20/20 correctable with a microscope, high level of manual dexterity, ability to lift 10 pounds minimum, basic computer skills and be able to pass production "A" type company administered physical. Read and interpret Engineering drawings. 12.) Requires significant attention to detail for production activities and documentation to maintain compliance with Mil. Standard requirements. |
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About Lockheed Martin Corporation
You may think you know us. Legendary aerospace milestones at the world's foremost provider of public sector systems engineering, software, and integration... dedicated to Mission Success. But look deeper. You will find we are also commercial information management hand-held medical devices, satellite telecommunications software solutions that drive, practically, everything. Most importantly, we are a company of countless opportunities.For us, being one of the world's leading technology and systems enterprises means providing: best value to a growing base of government and commercial customers worldwide, and compelling growth opportunities to our employees.
Equally wide are the challenges, the career choices, and the locations we offer.
We invite you to learn more about our current technical and non-technical openings nationwide for both experienced professionals and college graduates.
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